G10000 - SEMI G100 - Specification for Gel Time of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G100-1122 - Current SEMI M62-1105 (first published -

SEMI M62-1105 (first published - replaces SEMI M2 and SEMI M11)

·       設計と製造の間でレイアウト関連の情報の交換を容易にするために，より豊富な情報パレットを提供すること。

and automated test equipment

SEMI E37-0303 (designation update)

dielectric materials have proven to be a valuable alternative to silicon in the semiconductor and 3DS-IC packaging industry

G10000 - SEMI G100 - Specification for Gel Time of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G100-1122 - Current SEMI M62-1105 (first published -Mold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics to use for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular and sheet material are used for WLP and PLP and these materials require the different characteristics and performances. The characteristics