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本スタンダードは，Environmental
The purpose of this Standard is to establish a standard specification of marking on semiconductor devices to identify individual device by unique identification code and possible optional information to suggest a part of manufacturing information
binary Data Matrix symbology for front-surface marking of metal lead-frame strips (also called ‘strips’)
The alignment mark is preferable to be implemented at frontside final metal and/or backside metal layer masking
• Recall the various types of self-generating and passive sensors
G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling Revision:Default Title 本スタンダードは，EnvironmentalThis document is a guideline for the ordering of tooling required to mold and form plastic molded small outline semiconductor packages. It is to be used by packaging engineers, mold manufacturers, and end of line toolmakers as the basis for defining the limits of manufacturing tolerances. Referenced SEMI Standards None.